flip chip bonding

基本解釋

To be an advancing technology in capsulation, there is a well developing foreground for the thermosonic flip-chip bonding.
熱超聲倒裝鍵合作為前沿封裝技術具有良好的發(fā)展前景。
With the Doppler laser vibration measurement system, the vibration velocity curves of the flip chip and tool tip were obtained during thermo-sonic flip chip bonding.
采用多普勒激光振動測量系統(tǒng)，獲得了熱超聲倒裝鍵合過程中工具末端及芯片的振動速度曲線。